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Product Overview
The SAM21 CPU RAM BGA Reballing Stencil Template is a precision-engineered tool designed for flawless reballing of Samsung’s high-performance chips, including the S25 Ultra, S25+, SM8750, PM8550VE, 8550VS, WCN7851, MAX77775P, and SDR875 series. Whether you’re a professional repair technician or a hobbyist, this stencil ensures accurate ball placement, reducing defects and boosting yield.
Key Features
- High‑resolution laser‑cut stencil for exact ball alignment
- Compatible with a wide range of Samsung BGA packages (S25 Ultra, SM8750, PM8550VE, etc.)
- Durable, heat‑resistant material that withstands multiple reballing cycles
- Pre‑measured ball spacing for consistent solder paste application
- Easy to clean and reuse – extend your tool’s lifespan
- OEM‑grade quality with tight tolerances for professional results
Specifications
Material: High‑grade aluminum alloy with anti‑corrosion coating
Ball Pitch: 0.4 mm (adjustable for different BGA sizes)
Thickness: 0.15 mm for optimal stiffness
Dimensions: 12 mm × 12 mm (custom sizes available on request)
Compatibility: Samsung S25 Ultra, S25+, SM8750, PM8550VE, 8550VS, WCN7851, MAX77775P, SDR875 and other BGA modules
Why Choose SAM21?
Reballing is a critical step in BGA repair, and the right stencil can make all the difference. The SAM21 template delivers:
- Consistent ball placement – minimizing solder bridges and voids
- Reduced rework time – thanks to precise alignment and easy application
- Increased reliability – perfect for high‑density, high‑speed Samsung processors
- Cost savings – durable design cuts down on replacement frequency
Installation & Usage Guide
1. Prepare the board: Clean the BGA area and apply a thin layer of solder paste using a fine‑tip dispenser.
2. Place the stencil: Align the SAM21 stencil with the BGA pads and secure it with a light clamp.
3. Apply solder paste: Use a solder paste roller or brush to fill the stencil holes uniformly.
4. Remove the stencil: Carefully lift the stencil to reveal a clean, evenly spaced solder ball pattern.
5. Proceed with reballing: Heat the board in a reflow oven or use a reballing jig to melt the solder balls into place.
Follow these steps for a professional, repeatable reballing process that restores your Samsung BGA devices to factory‑like performance.
Price: $ 5.00