Description
Upgrade your repair and manufacturing workflow with the SAM18 BGA Stencil Reballing Kit, engineered specifically for Samsung’s latest mobile and CPU components. Designed to deliver flawless solder ball placement on the Exynos 1330, 1380, and other high‑density BGA packages, this stencil ensures precision and repeatability in every reballing operation.
Product Overview
The SAM18 stencil is a high‑resolution, laser‑cut template that provides optimal ball spacing and alignment for a wide range of Samsung devices, including the A35, M14 5G, A14, A54, and related SPU series (SPU15Q, SPU16, 58083‑11, 77098B). Whether you’re restoring a flagship smartphone or reballing a critical CPU module, this stencil delivers the accuracy required for reliable, long‑term performance.
Key Highlights
- Precision Design: 18‑layer laser‑etched pattern for exact ball placement.
- Wide Compatibility: Supports Samsung A35, M14 5G, A14, A54, Exynos 1330/1380, and more.
- Durable Construction: High‑grade stainless steel with anti‑corrosion coating.
- Easy to Use: Ready‑to‑install stencil with clear alignment marks.
- Consistent Results: Minimizes solder bridge and short‑circuit risk.
- Time‑Saving: Reduces reballing cycle time by up to 30%.
Technical Specifications
• Material: Stainless steel (316L)
• Thickness: 0.5 mm
• Ball Diameter: 0.5 mm – 0.7 mm (configurable)
• Pattern Resolution: 0.1 mm
• Compatible Boards: 1.2 mm – 1.6 mm PCB thickness
• Warranty: 12 months manufacturer’s guarantee
Why Choose SAM18?
Our stencil is crafted by specialists in semiconductor repair, ensuring that every ball is placed with the utmost precision. The result? Higher yield rates, fewer defects, and a significant reduction in production costs. Whether you’re a hobbyist or a professional repair shop, the SAM18 BGA Stencil delivers the quality and reliability you need.
Installation & Usage
1. Clean the BGA surface thoroughly.
2. Align the stencil over the pad layout using the built‑in reference marks.
3. Apply solder paste with a calibrated squeegee.
4. Remove the stencil carefully to avoid disturbing the paste.
5. Proceed with reballing or reflow as per your workflow.
Get the SAM18 BGA Stencil today and experience the difference in precision, durability, and performance for your Samsung BGA reballing projects.
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