Description
MECHANIC XG Series 183℃ Tin Solder Paste Environment Friendly Sn63 Soldering Flux for Mobile Phone IC CPU BGA SMD REPAIR
Sale!
MECHANIC XG Series 183℃ Tin Solder Paste Environment Friendly Sn63 Soldering Flux for Mobile Phone IC CPU BGA SMD REPAIR
Original price was: $ 5.03.$ 2.52Current price is: $ 2.52.
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