Description
Product Overview
Introducing the MECHANIC XG Series 183℃ Tin Solder Paste – a cutting‑edge, environment‑friendly Sn63 flux engineered for precision soldering of Mobile Phone ICs, CPUs, BGA, and SMD components. Designed for high‑temperature applications, this flux delivers exceptional wetting, reliable joint strength, and superior corrosion resistance while keeping your workspace safe and compliant with modern green electronics standards.
Key Highlights
- 183℃ tin solder paste with Sn63 composition – ideal for high‑performance IC and CPU soldering
- Environment‑friendly, low‑toxic flux – free from lead and harmful additives
- Excellent wetting and flow characteristics for BGA, QFN, and SMD packages
- Low residue, easy cleanup for repeatable, high‑yield manufacturing
- Long shelf life (≥12 months) when stored in a sealed container
- Compatible with automated reflow ovens, wave soldering, and hand soldering
Technical Specifications
Composition: Sn63 (63% tin, 37% copper) flux core
Temperature Range: 150℃ – 210℃ (optimal at 183℃)
Viscosity: 0.5 – 1.2 Pa·s at 180℃
Packaging: 100 g, 250 g, and 500 g tubes with airtight seal
Shelf Life: Minimum 12 months (sealed, stored at 25℃)
Compliance: RoHS, REACH, and FDA‑approved for medical device use
Ideal Applications
Perfect for:
- Mobile phone and tablet IC repair
- CPU, GPU, and microcontroller BGA reflow
- SMD and QFN surface‑mount assembly
- Repair shops, OEM production lines, and prototyping labs
Why Choose MECHANIC XG Series?
Our tin solder paste blends high‑temperature performance with green chemistry. It offers:
- Consistent flux strength for reliable solder joints
- Reduced risk of galvanic corrosion and contamination
- Easy cleanup and minimal post‑reflow residue
- Trusted by electronics repair professionals worldwide
Elevate your soldering workflow with the MECHANIC XG Series 183℃ Tin Solder Paste – the smart choice for precision, safety, and sustainability in modern electronics manufacturing.
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