MECHANIC SX-862 183℃ 60g Low Temperature Degree Melting Point Soldering Wire 0.3mm-1.2mm for BGA Solder Wire

Description

MECHANIC SX-862 Low‑Temperature Soldering Wire – 183 °C, 60 g

Engineered for precision electronics, the MECHANIC SX‑862 soldering wire delivers a reliable 183 °C melting point, perfect for delicate BGA (Ball Grid Array) rework and fine‑pitch components. Available in a versatile diameter range of 0.3 mm to 1.2 mm, this 60 g spool offers consistent flow, minimal oxidation, and excellent wetting on copper, gold, and nickel pads.

Key Highlights

• Low‑temperature formula (183 °C) reduces thermal stress on sensitive components.
• Wide diameter selection (0.3 mm‑1.2 mm) for both micro‑vias and larger pads.
• 60 g spool ensures ample supply for high‑volume production or repair labs.
• Lead‑free, RoHS‑compliant alloy for environmentally safe soldering.
• Superior flux core provides clean, oxidation‑free joints.
• Optimized for BGA, CSP, QFN, and fine‑pitch IC assemblies.

Technical Specifications

• Melting Point: 183 °C (low‑temperature grade)
• Alloy Composition: Sn‑Ag‑Cu (SAC) lead‑free formulation
• Wire Diameter: 0.3 mm, 0.5 mm, 0.8 mm, 1.0 mm, 1.2 mm
• Weight: 60 g per spool
• Flux Type: No‑clean, low‑residue core
• Compliance: RoHS, REACH

Ideal Applications

Designed for professional technicians and assembly lines, the SX‑862 excels in:

• Rework and repair of BGA and CSP devices.
• Prototype builds requiring precise solder flow.
• Low‑temperature processes that protect heat‑sensitive substrates.
• Small‑batch production where consistent joint quality is critical.

Why Choose MECHANIC SX‑862?

MECHANIC combines advanced alloy science with a clean‑flux core to give you solder joints that are strong, reliable, and free of post‑solder cleaning. The low melting point minimizes the risk of component delamination, while the range of diameters provides the flexibility needed for any fine‑pitch project.