Lead-containing and 181-degree silver-bearing solder paste for syringe soldering applied in SMT (Surface Mount Technology) chip

Description

Lead-Containing 181°C Silver-Bearing Solder Paste for SMT Chip Soldering

Elevate your surface‑mount assembly with our premium lead‑containing solder paste, engineered for 181°C silver‑bearing performance. Designed for syringe application, it delivers consistent, high‑quality joints for delicate SMT chips, ensuring reliable conductivity and robust mechanical strength.

Key Highlights

• High silver content for superior conductivity and corrosion resistance
• Low melting point (181 °C) for energy‑efficient, temperature‑sensitive components
• Lead‑based formulation for excellent wetting and strong adhesion
• Optimized for syringe dispensing – precise, controlled application
• Compatible with a wide range of SMT substrates (FR‑4, Rogers, ceramic)
• Excellent flow characteristics for uniform coverage on fine‑pitch devices
• Long shelf life (up to 24 months) when stored at 25 °C/60 % RH
• ISO 9001 & RoHS compliant – safe for electronics manufacturing

Technical Specifications

Composition: 60 % Sn, 20 % Ag, 15 % Pb, 5 % Bi (weight %)

Melting Range: 180–183 °C

Viscosity (20 °C): 3.2–3.8 Pa·s

Particle Size: 1–10 µm

Packaging: 100 g / 250 g / 500 g tubes or 1 kg bulk

Storage: 15–30 °C, keep container sealed

Application Guidelines

1. Preheat the PCB to 120–150 °C to reduce thermal shock.
2. Dispense the paste using a calibrated syringe for fine‑pitch components.
3. Apply a controlled amount to each pad, ensuring complete coverage without excess.
4. Reflow the board in a controlled atmosphere (N₂ or Ar) at 190–200 °C for 30–60 s.
5. Cool gradually to room temperature to avoid stress cracking.

Safety & Compliance

• RoHS‑compliant – no hazardous substances above regulatory limits.
• Lead content compliant with local regulations (e.g., EU RoHS, US EPA).
• Use protective gloves and eye protection during handling.
• Dispose of waste according to local hazardous waste regulations.

Why Choose Our Solder Paste?

Our lead‑containing 181°C silver‑bearing paste offers a proven balance between performance and cost. With a low melting point and high silver content, it delivers outstanding electrical conductivity, excellent wetting, and reliable mechanical strength—ideal for high‑density SMT assemblies and critical chip soldering.