KEK Sn63Pb37 Syringe Solder Paste 183℃ Medium Temperature Independent Packaging

Description

KEK Sn63Pb37 Syringe Solder Paste – 183℃ Medium Temperature, Independent Packaging

Product Overview

Designed for precision soldering in high‑density PCB assemblies, the KEK Sn63Pb37 Syringe Solder Paste delivers consistent, reliable joints at a medium reflow temperature of 183 °C. Encased in a convenient syringe with independent packaging, it offers easy handling, minimal waste, and superior control for both hobbyists and industrial manufacturers.

Key Highlights

• **Composition** – 63 % Tin, 37 % Lead (Sn63Pb37) for optimal wetting and mechanical strength.
• **Temperature Profile** – Ideal for 183 °C reflow ovens; compatible with most medium‑temperature soldering processes.
• **Syringe Format** – 1 mL or 3 mL syringes provide precise, controlled dispensing for fine pitch components.
• **Independent Packaging** – Each syringe is sealed separately, preventing cross‑contamination and extending shelf life.
• **Low Viscosity** – Smooth flow for uniform paste deposition and reduced voiding.
• **High Purity** – Manufactured under GMP standards, ensuring consistent performance and minimal impurities.
• **Versatile Applications** – Ideal for surface‑mount technology (SMT), through‑hole, and mixed‑signal boards.

Technical Specifications

Composition: Sn63Pb37 (Tin‑Lead alloy)
Melting Point: 183 °C (356 °F)
Viscosity: 1.5–2.0 Pa·s at 25 °C (typical)
Package: Syringe (1 mL or 3 mL), independent sealed
Shelf Life: 24 months from production date when stored at 15–25 °C, dry environment
Compliance: RoHS‑compliant (Lead‑free alternatives available upon request)

Application & Usage

Apply the paste using the syringe tip directly onto pads or via a stencil for precise placement. The medium‑temperature profile ensures reliable joints for components with moderate thermal budgets, such as power modules, connectors, and mixed‑signal ICs. After placement, a standard reflow profile (ramp to 183 °C, hold 3 min, cool) yields high‑quality, void‑free solder joints.

Packaging & Storage

Each syringe is individually sealed to prevent drying and contamination. Store in a cool, dry place (15–25 °C) away from direct sunlight. Avoid exposure to high humidity or temperatures above 30 °C to maintain paste integrity.

Why Choose KEK Sn63Pb37?

Our solder paste combines proven Sn63Pb37 chemistry with the convenience of syringe dispensing, making it an ideal choice for small‑batch prototyping and large‑scale production alike. The independent packaging ensures each unit remains fresh, while the medium‑temperature profile offers a balance between performance and equipment compatibility.

Upgrade your soldering workflow with KEK’s reliable, easy‑to‑use Sn63Pb37 Syringe Solder Paste – the smart choice for precision electronics manufacturing.