Description
ESP32 S3 C3 SuperMini Development Board – the ultimate compact solution for WiFi and Bluetooth IoT projects. Designed to fit into the smallest form factor, this dual‑core module combines the power of ESP32‑S3 and ESP32‑C3 into one sleek board, making it perfect for Arduino enthusiasts, hobbyists, and professional developers alike.
Key Highlights
- Dual‑core architecture: ESP32‑S3 (dual‑core Xtensa LX7) + ESP32‑C3 (single‑core RISC‑V)
- Integrated WiFi 802.11 b/g/n and Bluetooth 5.0 (BLE) for versatile connectivity
- Ultra‑small SuperMini footprint – ideal for wearable, smart‑home, and edge‑device applications
- Compatible with Arduino IDE and ESP-IDF for seamless development
- Rich peripheral set: 34 GPIOs, I2C, SPI, UART, PWM, ADC, DAC, and more
- Low power consumption with deep‑sleep modes and power‑saving features
- Robust security: hardware encryption, secure boot, and flash encryption
- Pre‑programmed firmware support for rapid prototyping
Why Choose the ESP32 S3 C3 SuperMini?
Whether you’re building a smart thermostat, a remote sensor node, or a custom IoT gateway, the ESP32 S3 C3 SuperMini delivers unparalleled performance in a pocket‑sized package. Its dual‑core design allows you to run complex tasks on the ESP32‑S3 while handling low‑latency Bluetooth communication on the ESP32‑C3, all without compromising on power efficiency.
Specifications
Processor: ESP32‑S3 (dual‑core Xtensa LX7) 240 MHz, ESP32‑C3 (single‑core RISC‑V) 160 MHz
Memory: 512 KB SRAM + 4 MB Flash (expandable via external SPI flash)
Connectivity: WiFi 802.11 b/g/n, Bluetooth 5.0 BLE
Operating Voltage: 3.0 V – 3.6 V
Dimensions: 25 mm × 20 mm (approx.)
USB Interface: Micro‑USB for programming and power (5 V input)
Applications
- Smart home automation and control panels
- Wearable health and fitness trackers
- Industrial IoT gateways and edge devices
- Robotics and autonomous systems
- Educational kits and maker projects
Ready to take your IoT projects to the next level? Add the ESP32 S3 C3 SuperMini Development Board to your toolkit today and experience the power of dual‑core connectivity in a single, compact module.
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