BGA Reballing Stencil Template For iPhone X XS 11 12 13 Mini 14 Plus 15 16 17 Pro Max LCD screen IC Positioning Plate tin net

Description

BGA Reballing Stencil Template For iPhone X, XS, 11, 12, 13, Mini, 14 Plus, 15, 16, 17, Pro Max LCD Screen IC Positioning Plate – Tin Net

Product Overview

Upgrade your mobile repair workflow with our precision‑engineered BGA reballing stencil template. Designed specifically for the latest iPhone models, this tin net positioning plate ensures accurate ball placement for LCD screen ICs, reducing rework time and improving yield on every repair job.

Key Highlights

• ✔️ Exact Compatibility: Tailored for iPhone X, XS, 11, 12, 13, Mini, 14 Plus, 15, 16, 17, and Pro Max LCD screens.
• ✔️ High‑Precision Tin Net: Micro‑etched pattern guarantees flawless ball placement and consistent solder joints.
• ✔️ Durable Construction: Made from premium stainless steel with a corrosion‑resistant finish for long‑term use.
• ✔️ Easy to Handle: Lightweight and compact, fits seamlessly into standard reballing stations.
• ✔️ Time‑Saving Design: Reduces manual alignment errors, speeding up the reballing process by up to 30%.
• ✔️ Reusable: Reusable across multiple devices; no need to replace after each job.
• ✔️ Compliant with Industry Standards: Meets IPC‑J-STD‑001 and JEDEC specifications for BGA reballing.

Why Choose This Template?

When repairing high‑density BGA ICs on modern iPhones, precision is everything. Our stencil template offers:

• Consistent ball placement for reliable solder joints.
• Reduced risk of bridging or misalignment.
• Enhanced repeatability across multiple devices.
• Minimal setup time – just place the template and proceed with reballing.

Compatibility & Usage

Compatible with all major reballing machines and hand‑soldering setups. To use:

• Align the stencil plate over the LCD screen IC.
• Secure with a lightweight clamp or adhesive pads.
• Apply solder paste using a calibrated dispenser.
• Proceed with reballing according to your standard workflow.

Specifications

• Material: Stainless steel with tin‑net pattern.
• Dimensions: 70mm × 50mm (custom sizes available on request).
• Thickness: 0.5mm.
• Pattern Accuracy: ±0.05mm.
• Color: Silver finish.
• Weight: 25g.

Elevate your repair precision and reduce turnaround time with our BGA reballing stencil template – the essential tool for every professional iPhone repair technician.