Upgrade your electronics repair toolkit with the MECHANER Leaded Solder Balls 0.2‑0.76 mm BGA Reballing Kit. Designed for precision micro‑welding, this comprehensive 10,000‑piece kit delivers consistent, high‑quality solder joints for PCB, IC chip, and mobile phone repairs.
Key Highlights
- 🔧 Wide Size Range: 0.2 mm to 0.76 mm diameter covers most BGA, CSP, and QFN packages.
- 📦 10,000 Pieces: Sufficient volume for professional workshops, repair labs, or hobbyist projects.
- ⚙️ Leaded Formulation: Easy to melt and reflow, providing reliable wetting and strong mechanical strength.
- 🛡️ RoHS‑Compliant: Environmentally safe without compromising performance.
- 🔍 Uniform Sphericity: Guarantees even heat distribution and minimizes voids.
- ⚡️ Fast Reballing: Reduces downtime during component replacement.
Why Choose MECHANER BGA Reballing Kit?
Whether you’re restoring a cracked smartphone motherboard, fixing a laptop GPU, or prototyping a custom PCB, our leaded solder balls provide the consistency and reliability that professional technicians demand. The precise size tolerance ensures perfect alignment with pad layouts, while the leaded alloy offers a lower melting point for smoother reflow and reduced thermal stress on delicate components.
Perfect For
- Mobile phone and tablet motherboard repair
- Computer graphics and processor BGA rework
- Industrial PCB refurbishment
- Micro‑welding and fine‑pitch component replacement
- Educational labs and electronics training
Technical Specifications
- Material: Sn‑Pb leaded alloy (63/37)
- Diameter range: 0.20 mm – 0.76 mm
- Quantity: 10,000 balls (pre‑sorted by size)
- Packaging: Anti‑static resealable bag
- Compliance: RoHS, ISO‑9001
Boost Your Repair Efficiency
With the MECHANER Leaded Solder Balls kit, you’ll experience faster reballing cycles, stronger solder joints, and fewer re‑work attempts. Trust a product engineered for the demanding needs of modern electronics repair and keep your devices running like new.
Price: Original price was: $ 8.65.$ 4.33Current price is: $ 4.33.

