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Leaded BGA Solder Balls – 25,000pcs Pack
High‑performance leaded solder balls ideal for BGA, CSP, and other surface‑mount applications. This bulk pack offers a wide range of diameters from 0.2 mm to 0.76 mm, ensuring you have the perfect size for every board design.
Key Features
- Pure Sn‑Pb alloy (63% Sn / 37% Pb) for excellent wetting and low reflow temperature.
- Diameter range: 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm, 0.5 mm, 0.55 mm, 0.6 mm, 0.65 mm, 0.76 mm.
- High ball density (≈ 1 mm²) for reliable electrical connections.
- Low coefficient of thermal expansion (CTE) matches most PCB substrates.
- Pre‑cleaned and coated with a thin oxide‑resistant layer for consistent performance.
- Bulk packaging in a 25,000‑piece tray for cost‑effective storage and handling.
Specifications
Material: Sn‑Pb (63/37) alloy
Reflow temperature: 210 °C – 240 °C (typical)
Operating temperature range: –55 °C to +125 °C
Shelf life: 24 months at 25 °C, 60 % RH
Applications
Ideal for:
- Ball Grid Array (BGA) and Chip Scale Package (CSP) reflow soldering.
- High‑density interconnects in aerospace, automotive, and consumer electronics.
- Repair and prototyping of surface‑mount assemblies.
Packaging & Shipping
Each ball is individually sealed in a protective film. The 25,000‑piece tray is sealed and labeled for easy inventory. Ships via air or sea freight with tracking. 30‑day return policy for quality assurance.
Price: $ 3.96