Amaoe BGA Reballing Stencil DDR DDR5/DDR6/BGA170/BGA180/DDR5X/BGA190 Video Memory Chip Graphics Tin Planting Solder Template

Amaoe BGA Reballing Stencil DDR DDR5/DDR6/BGA170/BGA180/DDR5X/BGA190 Video Memory Chip Graphics Tin Planting Solder Template

Amaoe BGA Reballing Stencil – Precision Solder Template for DDR, DDR5, DDR6, DDR5X & BGA Video Memory Chips

Upgrade your soldering workflow with the Amaoe BGA Reballing Stencil, engineered for flawless tin plating on high‑performance video memory chips. Whether you’re reballing DDR, DDR5, DDR6, DDR5X, BGA170, BGA180 or BGA190 packages, this stencil delivers consistent, repeatable results that meet professional standards.

Key Highlights

  • Universal Compatibility: Designed for DDR, DDR5, DDR6, DDR5X, BGA170, BGA180, BGA190 and other common video memory footprints.
  • Precision‑Cut Apertures: Laser‑etched micro‑holes ensure even solder paste distribution for every pin.
  • High‑Quality Material: Made from durable stainless‑steel with a corrosion‑resistant coating for long‑term use.
  • Easy Alignment: Built‑in alignment marks simplify placement and reduce setup time.
  • Reusable Design: Engineered to withstand thousands of reballing cycles without loss of accuracy.
  • Optimized for Tin Planting: Perfect for both lead‑free and leaded solder alloys, delivering clean, reliable joints.

Why Choose Amaoe?

When precision matters, trust a stencil that professionals rely on. The Amaoe BGA Reballing Stencil minimizes solder waste, cuts rework, and speeds up production—whether you’re a repair technician, a hobbyist, or a manufacturing line.

Ideal For

  • GPU and graphics card refurbishment
  • Motherboard and server memory module repair
  • Prototype development and testing
  • Small‑batch production and R&D labs

How It Works

1. Align the stencil’s marks with the BGA package.
2. Apply a thin, even layer of solder paste on the stencil.
3. Press the stencil onto the chip and gently scrape to fill all apertures.
4. Remove the stencil and proceed with reflow for a perfect solder ball array.

Specifications

  • Material: Stainless steel (304) with anti‑oxidation coating
  • Thickness: 0.1 mm (optimal for fine‑pitch BGA)
  • Dimensions: Custom‑cut to match DDR/DDR5/DDR6/BGA170/BGA180/BGA190 footprints
  • Package: 1 × Stencil (ready for immediate use)

Boost your soldering accuracy and reduce downtime with the Amaoe BGA Reballing Stencil – the essential tool for flawless video memory chip reballing.


Price: Original price was: $ 24.72.Current price is: $ 17.80.

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