Description
MECHANIC XG Series 183℃ Tin Solder Paste Environment Friendly Sn63 Soldering Flux for Mobile Phone IC CPU BGA SMD REPAIR
Sale!
MECHANIC XG Series 183℃ Tin Solder Paste Environment Friendly Sn63 Soldering Flux for Mobile Phone IC CPU BGA SMD REPAIR
Original price was: 5.03 $.2.52 $Current price is: 2.52 $.
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