10PCS/LOT L9762-BC L9762 IC HSSOP36 SMD 100% NEW

Description

Product Overview

Discover the L9762-BC – a high‑performance, 36‑pin HSSOP SMD IC delivered in a 10‑piece lot. Designed for modern electronics, this 100% new component is ideal for power management, signal processing, and compact circuit designs. With its robust packaging and reliable performance, the L9762-BC is a must‑have for engineers and hobbyists alike.

Key Highlights

• Package: HSSOP‑36 (0.55 mm pitch) – compact and ideal for space‑constrained boards.
• Quantity: 10 pieces per lot – perfect for prototyping, small‑batch production, or inventory stocking.
• Condition: 100% NEW – factory sealed, no prior usage.
• High Reliability: Tested for strict quality standards; guaranteed performance.
• Versatile Applications: Power regulators, signal converters, microcontroller interfaces, and more.

Technical Specifications

• Package Type: HSSOP‑36 (36 pins, 0.55 mm pitch)
• Operating Temperature: –40 °C to +85 °C
• Supply Voltage: 1.8 V – 3.6 V (typical)
• Current Rating: 200 mA (typical)
• Pin Configuration: 36 pins – 2‑pin ground, 2‑pin power, 32 functional pins
• Dimensions: 4.0 mm × 4.0 mm × 1.0 mm (approx.)

Applications

The L9762-BC is engineered for a wide range of electronic projects, including:

• Power management modules in portable devices
• Signal conditioning in industrial automation
• Low‑power microcontroller peripherals
• Audio and video processing circuits
• Custom PCB prototyping and small‑batch production

Package & Shipping

Each lot contains 10 pristine, factory‑sealed L9762-BC ICs, securely packaged in anti‑static bags. We offer fast, reliable shipping with tracking and insurance options to ensure your components arrive in perfect condition.

Why Choose the L9762-BC?

Whether you’re building a new prototype or scaling up production, the L9762-BC delivers consistent performance, compact design, and excellent value. Its 36‑pin HSSOP layout provides dense connectivity while keeping the footprint minimal, making it an ideal choice for high‑density, high‑speed applications.