Description
MECHANIC 183℃ Solder Tin Paste Sn63/Pb37 – Premium BGA Reballing & SMD Flux Cream
Elevate your PCB rework and repair work with the MECHANIC 183℃ Solder Tin Paste, specifically engineered for BGA reballing, IC CPU soldering, and mobile phone SMD assemblies. This high‑quality Sn63/Pb37 flux paste delivers a stable 183°C melting point, ensuring reliable, low‑temperature reflow for delicate components while maintaining excellent wetting and adhesion.
Key Highlights
- Optimal Melting Point: 183°C – ideal for sensitive mobile phone ICs and CPUs.
- High Purity Sn63/Pb37: 63% Tin / 37% Lead composition for superior mechanical strength and conductivity.
- Excellent Wetting & Flow: Smooth, uniform coverage on BGA pads and SMD leads.
- Low Residue & Clean Finish: Minimal post‑solder flux residue, reducing cleaning time.
- Long Shelf Life: Stable formulation keeps the paste fresh for extended periods.
- Easy Application: Cream consistency allows precise placement with tweezers or syringe.
Technical Specifications
• Composition: Sn63/Pb37 (63% Tin / 37% Lead)
• Melting Point: 183 °C
• Viscosity: Medium‑thick cream
• Packaging: 5 g / 10 g / 50 g tubes (recyclable)
• Storage: Keep in a cool, dry place; seal tightly after use.
Applications
• BGA reballing for mobile phones and tablets
• CPU & IC surface‑mount rework on PCBs
• SMD soldering on high‑density boards
• Repair of delicate electronic components where low‑temperature flux is critical
Why Choose MECHANIC 183℃?
Designed for professional technicians and hobbyists alike, this solder paste combines industry‑standard reliability with user‑friendly application. Its 183°C melting point protects heat‑sensitive devices, while the robust Sn63/Pb37 alloy ensures long‑term performance. Whether you’re reballing a BGA or repairing a cracked CPU, MECHANIC provides the consistency and precision you need for flawless results.
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