Description
MECHANIC 183℃ XGZ40 Solder Paste Flux Sn63/Pb37 – the ultimate welding tin paste for mobile phone IC, CPU, BGA, and SMD repairs. Designed for precision and reliability, this high‑performance solder paste delivers excellent flow, strong joint integrity, and minimal residue, ensuring your devices stay pristine and functional.
Product Overview
Engineered with a 63% tin / 37% lead composition, the MECHANIC XGZ40 solder paste is ideal for professional mobile phone repairs. Its 183℃ melting point provides a wide temperature window, making it compatible with most reflow ovens and hand‑soldering setups. The built‑in flux guarantees clean, oxide‑free surfaces for superior electrical connectivity.
Key Highlights
- High‑purity Sn63/Pb37 alloy for reliable solder joints
- 183℃ melting point – optimal for BGA, SMD, and CPU rework
- Pre‑mixed flux eliminates contamination and reduces rework time
- Low viscosity for precise application on tight component pitches
- Long shelf life – stable for up to 12 months when stored properly
- Safe, low‑smoke formulation meets RoHS compliance
- Compact 40 g cartridge for on‑site repairs or workshop use
Technical Specifications
Composition: Sn63/Pb37 (63% Sn, 37% Pb) with proprietary flux blend
Melting Point: 183 °C (356 °F)
Viscosity: 0.8–1.2 Pa·s at 25 °C
Package: 40 g cartridge with built‑in syringe tip
Storage: Keep in a cool, dry place; seal after each use
Applications
Perfect for:
- Mobile phone and tablet IC rework
- CPU and BGA soldering on smartphones and laptops
- Precision SMD repair for high‑density circuits
- Prototyping and hobbyist projects requiring reliable solder joints
Why Choose MECHANIC XGZ40?
Our solder paste blends the best of industrial reliability with user‑friendly design. Whether you’re a seasoned technician or a DIY enthusiast, the MECHANIC 183℃ XGZ40 ensures consistent performance, minimal waste, and a clean finish—every time. Upgrade your repair toolkit and experience the difference in quality and efficiency.
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