Description
MECHANIC M35 Nano Flux Paste is the ultimate solution for precision electronics repair. Designed for high‑performance welding on PCBs, ICs, mobile phone chips, CPUs, LEDs, and BGA packages, this nano‑flux paste ensures clean, reliable connections and protects components during soldering.
Product Overview
Engineered with advanced nano‑technology, the M35 paste delivers superior flow and minimal residue. Its low viscosity allows it to penetrate tight spaces while maintaining a strong bond, making it ideal for modern electronics repair and prototyping.
Key Features
- Ultra‑thin nano‑flux formula for precise application
- High thermal stability up to 260 °C
- Corrosion‑resistant and non‑conductive after curing
- Excellent wetting on copper, gold, and silver surfaces
- Safe for use on sensitive ICs, CPUs, and BGA packages
- Easy to clean – no harsh solvents required
- Compact, travel‑friendly packaging for on‑site repairs
Benefits
With the MECHANIC M35, technicians can achieve:
- Consistent, high‑quality solder joints
- Reduced risk of cold solder joints and bridges
- Longer component lifespan due to corrosion protection
- Faster workflow with minimal cleanup
- Versatility across a wide range of electronic devices
How to Use
1. Clean the target surface with isopropyl alcohol.
2. Apply a thin layer of M35 paste to the solder pads.
3. Heat with a soldering iron or reflow oven as per standard procedure.
4. Allow to cool and inspect for a solid, clean joint.
Why Choose MECHANIC M35
Whether you’re repairing a smartphone, assembling a custom PCB, or troubleshooting a BGA package, the MECHANIC M35 Nano Flux Paste offers unmatched performance, reliability, and ease of use. Trust in a product that supports the highest standards of electronics manufacturing and repair.
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