U-MTK4 BGA Stencil Reballing For MT6761V MT6762V MT6765V MT6768V MT6769 MT6771V MT6779V Helio A22 P22 P40 P65 G80 P60 P90 EMMC

Description

U-MTK4 BGA Stencil Reballing Kit for MT6761V, MT6762V, MT6765V, MT6768V, MT6769, MT6771V, MT6779V, Helio A22, P22, P40, P65, G80, P60, P90, and EMMC

Product Overview

Elevate your PCB reballing workflow with the U-MTK4 BGA stencil kit—engineered for precision, durability, and compatibility with a wide range of MediaTek Helio processors and EMMC modules. Designed for both professional repair shops and hobbyists, this kit delivers consistent ball placement and reliable solder joints for high-density BGA packages.

Key Features

• High‑resolution 0.5 mm pitch stencil for accurate ball placement
• Durable, laser‑cut stainless steel construction resists corrosion and wear
• Pre‑cut stencil layout matches MT6761V‑MT6779V series and Helio A22/P22/P40/P65/G80/P60/P90 devices
• Easy-to-use design with clear alignment markers for quick setup
• Compatible with standard reballing machines and manual reballing setups
• Includes detailed application guide and safety instructions

Technical Specifications

• Stencil material: Stainless steel 316L
• Pitch: 0.5 mm (BGA ball diameter)
• Stencil thickness: 0.3 mm
• Ball size: 0.5 mm (standard BGA ball)
• Compatibility: MT6761V, MT6762V, MT6765V, MT6768V, MT6769, MT6771V, MT6779V, Helio A22, P22, P40, P65, G80, P60, P90, EMMC
• Operating temperature: –40 °C to +85 °C

Compatibility

• MediaTek Helio MT6761V‑MT6779V series processors
• Helio A22, P22, P40, P65, G80, P60, P90 SoC families
• EMMC modules for mobile and embedded devices
• Standard BGA packages (0.5 mm pitch)

Installation & Usage

1. Clean the PCB pad area with isopropyl alcohol and a lint‑free cloth.
2. Align the stencil using the built‑in markers and secure it with the provided clamps.
3. Apply a thin layer of solder paste (preferably 0.5 mm pitch paste) onto the stencil openings.
4. Place the BGA component onto the stencil, ensuring perfect alignment.
5. Reball the component using your reballing machine or manual reballing jig.
6. Inspect the solder joints under magnification and rework if necessary.

Why Choose U-MTK4?

• Precision engineered for MediaTek Helio and EMMC devices
• Long‑lasting stainless steel construction reduces maintenance
• Consistent ball placement improves yield and reduces defects
• Comprehensive support materials: user guide, FAQs, and video tutorials
• Fast shipping and responsive customer service

Customer Support & Warranty

Enjoy a 12‑month limited warranty on manufacturing defects. For any questions, our technical support team is available 24/7 via email or live chat. We also provide replacement parts and upgrades for evolving BGA standards.