Description
Precision BGA Reballing Stencil for Apple iPad Series
Restore your Apple iPad to full functionality with this high-precision BGA reballing stencil, specifically engineered for the A12, A12Z, and A12X processors. Designed for professional micro-soldering and repair technicians, this stencil ensures accurate ball placement for both CPU and EMMC NAND chips, minimizing the risk of shorts and maximizing the success rate of your reballing process.
Universal Compatibility
This versatile stencil is compatible with a wide range of popular iPad models, making it an essential tool for any repair shop specializing in Apple devices. It is specifically designed to fit the following chipsets and models:
- Supported Models: iPad Pro 2018, 2019, 2020; iPad Air 3; iPad Mini 5; iPad 7th Generation.
- Compatible Processors: A12 Bionic, A12Z Fusion, and A12X Fusion CPUs.
- Chip Part Numbers: CD3217B12, CD3217B13, and CD3215C00.
- Memory Support: Includes precise alignment for EMMC and NAND flash memory components.
Engineered for Precision & Durability
Crafted from high-quality, heat-resistant stainless steel, this stencil is built to withstand the rigors of repeated use in a professional workshop environment. The laser-cut design ensures that each opening is perfectly sized to prevent ball migration and ensure clean, consistent reballing. Whether you are repairing a liquid-damaged board or replacing a faulty processor, this stencil provides the accuracy needed to achieve a reliable solder joint.
Key Features
- High-Precision Laser Cutting: Guarantees exact fit for specific BGA patterns to prevent solder bridges.
- Multi-Model Support: One stencil covers multiple iPad generations and processor variants.
- Durable Metal Construction: Resists warping and deformation during high-temperature reballing procedures.
- Easy to Clean: Smooth surface allows for quick removal of residual solder and flux after use.
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