SAM21 CPU RAM BGA Reballing Stencil Template For Samsung S25 Ultra S25Ultra S25+ SM8750 PM8550VE 8550VS WCN7851 MAX77775P SDR875

Description

Product Overview

The SAM21 CPU RAM BGA Reballing Stencil Template is a precision-engineered tool designed for flawless reballing of Samsung’s high-performance chips, including the S25 Ultra, S25+, SM8750, PM8550VE, 8550VS, WCN7851, MAX77775P, and SDR875 series. Whether you’re a professional repair technician or a hobbyist, this stencil ensures accurate ball placement, reducing defects and boosting yield.

Key Features

• High‑resolution laser‑cut stencil for exact ball alignment
• Compatible with a wide range of Samsung BGA packages (S25 Ultra, SM8750, PM8550VE, etc.)
• Durable, heat‑resistant material that withstands multiple reballing cycles
• Pre‑measured ball spacing for consistent solder paste application
• Easy to clean and reuse – extend your tool’s lifespan
• OEM‑grade quality with tight tolerances for professional results

Specifications

Material: High‑grade aluminum alloy with anti‑corrosion coating
Ball Pitch: 0.4 mm (adjustable for different BGA sizes)
Thickness: 0.15 mm for optimal stiffness
Dimensions: 12 mm × 12 mm (custom sizes available on request)
Compatibility: Samsung S25 Ultra, S25+, SM8750, PM8550VE, 8550VS, WCN7851, MAX77775P, SDR875 and other BGA modules

Why Choose SAM21?

Reballing is a critical step in BGA repair, and the right stencil can make all the difference. The SAM21 template delivers:

• Consistent ball placement – minimizing solder bridges and voids
• Reduced rework time – thanks to precise alignment and easy application
• Increased reliability – perfect for high‑density, high‑speed Samsung processors
• Cost savings – durable design cuts down on replacement frequency

Installation & Usage Guide

1. Prepare the board: Clean the BGA area and apply a thin layer of solder paste using a fine‑tip dispenser.
2. Place the stencil: Align the SAM21 stencil with the BGA pads and secure it with a light clamp.
3. Apply solder paste: Use a solder paste roller or brush to fill the stencil holes uniformly.
4. Remove the stencil: Carefully lift the stencil to reveal a clean, evenly spaced solder ball pattern.
5. Proceed with reballing: Heat the board in a reflow oven or use a reballing jig to melt the solder balls into place.

Follow these steps for a professional, repeatable reballing process that restores your Samsung BGA devices to factory‑like performance.