Description
Product Overview
Introducing the GC1 CPU BGA Reballing Stencil Template Station – the ultimate solution for precision reballing and stencil application on high-density BGA packages. Designed for a wide range of devices, including the Switch NS2, H58GE6AK8B, CP10359AT, MAX77851S, S2349, DA9092, and PI2SSD, this station delivers consistent results every time.
Key Features
- High-precision stencil template for accurate ball placement
- Easy-to-use, adjustable platform for various BGA sizes
- Compatible with a wide range of plant tin nets and reflow profiles
- Durable construction with heat-resistant materials
- Integrated safety features for safe operation in lab environments
Technical Specifications
• Stencil Material: High-quality stainless steel
• Stencil Thickness: 0.15–0.25 mm
• Ball Size: 0.3–0.8 mm (adjustable)
Compatibility
The GC1 station is engineered to work seamlessly with:
- Switch NS2 BGA packages
- H58GE6AK8B, CP10359AT, MAX77851S, S2349, DA9092, PI2SSD components
- Standard plant tin nets used in reflow soldering
Benefits
- Reduces rework time and improves yield
- Consistent ball placement for reliable solder joints
- Versatile platform that supports multiple BGA types
- Compact design fits comfortably in any lab or production line
- Long-lasting durability reduces replacement costs
Why Choose GC1
Our GC1 CPU BGA Reballing Stencil Template Station combines industry-leading precision with user-friendly design. Whether you’re a hobbyist, a small repair shop, or a large manufacturing facility, GC1 delivers the reliability and performance you need to keep your production line running smoothly.
Customer Support
We offer comprehensive technical support, detailed user manuals, and quick-response service to ensure your GC1 station performs at its best. Contact our support team for any questions or assistance with setup and troubleshooting.
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