Leaded Soldering Balls BGA Solder Balls 25,000pcs 0.2mm/0.25MM/0.3mm/0.35mm/0.4mm/0.45mm/0.5mm/0.55/0.6mm/0.65mm/0.76mm

Description

Leaded BGA Solder Balls – 25,000pcs Pack

High‑performance leaded solder balls ideal for BGA, CSP, and other surface‑mount applications. This bulk pack offers a wide range of diameters from 0.2 mm to 0.76 mm, ensuring you have the perfect size for every board design.

Key Features

• Pure Sn‑Pb alloy (63% Sn / 37% Pb) for excellent wetting and low reflow temperature.
• Diameter range: 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm, 0.5 mm, 0.55 mm, 0.6 mm, 0.65 mm, 0.76 mm.
• High ball density (≈ 1 mm²) for reliable electrical connections.
• Low coefficient of thermal expansion (CTE) matches most PCB substrates.
• Pre‑cleaned and coated with a thin oxide‑resistant layer for consistent performance.
• Bulk packaging in a 25,000‑piece tray for cost‑effective storage and handling.

Specifications

Material: Sn‑Pb (63/37) alloy
Reflow temperature: 210 °C – 240 °C (typical)
Operating temperature range: –55 °C to +125 °C
Shelf life: 24 months at 25 °C, 60 % RH

Applications

Ideal for:

• Ball Grid Array (BGA) and Chip Scale Package (CSP) reflow soldering.
• High‑density interconnects in aerospace, automotive, and consumer electronics.
• Repair and prototyping of surface‑mount assemblies.

Packaging & Shipping

Each ball is individually sealed in a protective film. The 25,000‑piece tray is sealed and labeled for easy inventory. Ships via air or sea freight with tracking. 30‑day return policy for quality assurance.