Description
Upgrade your PCB prototyping and repair workflow with our 10‑Pack TSSOP16 SSOP16 SOP16 to DIP16 Transfer Board. Designed for precision and durability, this pitch adapter lets you effortlessly migrate compact surface‑mount components to a more accessible DIP format, saving time and reducing errors on the bench.
Product Overview
Each set contains ten high‑quality, pre‑cut transfer boards that convert 16‑pin TSSOP, SSOP, or SOP packages into a standard 0.1‑inch DIP footprint. Ideal for hobbyists, engineers, and repair technicians who need a reliable bridge between modern small‑package ICs and classic breadboard or socket solutions.
Key Highlights
- Compatible with TSSOP16, SSOP16, and SOP16 packages
- Converts to a standard 0.1‑inch DIP16 layout
- Precision‑etched copper pads for secure solder joints
- High‑temperature, lead‑free FR‑4 construction
- Pre‑assembled, ready‑to‑use out of the box
- Compact size: 18 mm × 12 mm (approx.) for easy storage
- Bulk pack of 10 boards – perfect for labs, workshops, or production lines
- Compatible with most 0.1‑inch pin sockets and breadboards
Technical Specifications
Material: FR‑4, copper clad
Board Thickness: 1.6 mm
Pad Pitch: 0.1 inch (2.54 mm)
Component Types: TSSOP16, SSOP16, SOP16
Quantity: 10 per pack
Applications
This transfer board is ideal for:
- Prototyping and debugging of small‑package ICs
- Educational labs where DIP sockets are preferred
- Repairing and upgrading legacy boards with modern components
- Rapid testing of firmware on a breadboard environment
Package Includes
10 x TSSOP16 SSOP16 SOP16 to DIP16 Transfer Boards, each pre‑cut and ready for soldering.
Transform your workflow with these reliable, cost‑effective pitch adapters. Order now and experience the convenience of seamless component migration!
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