Written by 
Product Overview
Elevate your PCB repair and rework capabilities with the Direct Heat BGA Stencil DDR1 DDR2 DDR3 DDR5 DR2-3 DDR3-2 GDDR5 BGA Reballing Kit Rework Station. Designed for precision and reliability, this all-in-one kit delivers consistent ball placement and solder quality for high-density BGA packages across a wide range of memory and graphics chips.
Key Highlights
- ✔️ Direct Heat BGA Stencil: Optimized for rapid, even heating to ensure flawless solder joints.
- ✔️ Versatile Compatibility: Supports DDR1, DDR2, DDR3, DDR5, DR2-3, DDR3-2, GDDR5, and other BGA packages.
- ✔️ Precision Reballing: Built-in ball placement guides for consistent pitch and alignment.
- ✔️ Robust Rework Station: Includes temperature control, airflow, and safety features for professional results.
- ✔️ High-Quality Solder: Premium flux and solder paste for superior wetting and reliability.
- ✔️ Time‑Saving Design: One‑step process reduces labor and minimizes risk of damage.
Technical Specifications
- Stencil Material: 6061 aluminum alloy
- Stencil Thickness: 0.5 mm
- Ball Pitch: 0.5 mm – 1.0 mm (adjustable)
- Temperature Range: 250 °C – 350 °C (programmable)
- Power Supply: 120 V AC, 60 Hz
- Dimensions: 300 mm × 200 mm × 150 mm
- Weight: 8 kg
Ideal Applications
Perfect for electronics repair shops, R&D labs, and OEM production lines that require:
- Rapid BGA reballing for DDR and GDDR memory modules
- High‑volume rework of multi‑layer PCBs
- Precision soldering for critical signal integrity
- Training and prototyping of BGA assembly processes
Why Choose This Kit?
Our Direct Heat BGA Stencil kit combines industry‑tested design with user‑friendly features, ensuring consistent quality and repeatable results. Whether you’re repairing a single board or running a high‑throughput line, this kit delivers the performance, reliability, and ease of use that professionals demand.
Price: $ 2.86