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Amaoe BGA Reballing Stencil – DDR7, DDR5, DDR6, BGA170, BGA180 Video Memory Chip Tin Planting Steel Mesh IC Solder Template
Upgrade your PCB assembly process with the Amaoe BGA Reballing Stencil, engineered for high‑precision tin planting and soldering of advanced memory chips. Designed specifically for DDR5, DDR6, and DDR7 video memory modules, this stencil delivers consistent ball placement, reducing rework and enhancing yield.
Product Overview
Our BGA reballing stencil features a durable steel mesh that ensures optimal solder flow and reliable ball placement across BGA170 and BGA180 packages. The template’s fine aperture design accommodates the tight pitch of modern memory ICs, making it ideal for both prototyping and high‑volume production.
Key Features
- Precision steel mesh for consistent solder ball placement
- Compatible with DDR5, DDR6, DDR7 video memory chips
- Supports BGA170 and BGA180 package sizes
- Easy to clean and maintain for repeatable use
- Optimized for tin planting and solder template applications
- High thermal conductivity for efficient heat transfer during reflow
- Robust construction to withstand repeated thermal cycling
Specifications
Material: Steel Mesh
Package Compatibility: BGA170, BGA180
Target Devices: DDR5, DDR6, DDR7 video memory ICs
Dimensions: Customizable to match specific PCB layouts
Operating Temperature: Up to 400 °C (reflow range)
Applications
This stencil is perfect for:
- High‑density memory module assembly
- Reballing and rework of BGA memory ICs
- Precision tin plating for advanced graphics processors
- Rapid prototyping and small‑batch production of memory boards
Enhance your assembly line’s reliability and speed with the Amaoe BGA Reballing Stencil – the essential tool for modern DDR memory and graphics IC manufacturing.
Price: Original price was: $ 5.42.$ 4.88Current price is: $ 4.88.