BGA Reballing Stencil Template For EMMC EMCP UFS UMCP LPDDR NAND BGA153 BGA169 BGA221 BGA297 BGA254 BGA178 BGA200 BGA110 BGA186

BGA Reballing Stencil Template for EMMC, EMCP, UFS, UMCP, LPDDR, NAND

BGA Reballing Stencil Templates for Various BGA Sizes

Upgrade your PC or mobile device repair skills with our premium BGA reballing stencil templates. Designed for professionals, these templates are a must-have for repairing EMMC, EMCP, UFS, UMCP, LPDDR, NAND, BGA153, BGA169, BGA221, BGA297, BGA254, BGA178, BGA200, and BGA110 chips.

Each stencil template is crafted from high-quality materials, ensuring durability and precise alignment during reballing processes. These templates are compatible with various soldering irons and rework stations, making them versatile for your repair needs.

Key Features:

• Compatible with: BGA153, BGA169, BGA221, BGA297, BGA254, BGA178, BGA200, BGA110, and BGA186 chips
• Material: High-quality materials for durability and precise alignment
• Versatile: Compatible with various soldering irons and rework stations
• Easy to use: Saves time and ensures accurate chip reballing

How to Use:

1. Clean the soldering area on your device
2. Select the appropriate stencil template based on your chip size
3. Place the template over the BGA chip and align it properly
4. Apply solder paste through the holes using a soldering iron
5. Remove the template and reflow the solder for a perfect reball

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Price: $ 5.50

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