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Product Overview
Kingb RMA 218 NC 559 Flux Tin is a high‑performance electronic welding solder paste designed for SMD soldering, mobile reballing, and universal PCB repair. Its low‑viscosity, non‑corrosive formula ensures a clean, reliable bond for both hobbyists and professional technicians.
Key Highlights
- Premium flux composition – removes oxides and improves wetting.
- Low‑smoke, non‑acidic – safe for indoor work and reduces cleanup.
- High thermal conductivity – ensures consistent heat transfer.
- Easy application – compatible with most paste applicators and reflow ovens.
- Universal fit – works with 0.5 mm to 2.0 mm SMD components.
- Long shelf life – stable under controlled storage conditions.
Benefits
- Reduces solder joint failures caused by oxidation.
- Improves yield on high‑density PCB assemblies.
- Minimizes flux residue, keeping surfaces clean for future rework.
- Enhances reflow uniformity, lowering the risk of bridging.
- Supports rapid mobile device repair and custom PCB builds.
Applications
Ideal for mobile phone reballing, tablet repairs, laptop motherboard work, automotive electronics, and any SMD assembly requiring a reliable solder paste. Its universal formula works with lead‑free and leaded solder alloys.
Specifications
- Package size: 50 g (1 oz) tin‑solder paste.
- Viscosity: 4–6 cP at 25 °C.
- Temperature range: 0 °C to 120 °C (storage).
- Lead content: < 0.1 % (Lead‑free).
- Manufacturer: Kingb Electronics.
Why Choose Kingb RMA 218 NC 559?
With a proven track record in the electronics industry, Kingb delivers a solder paste that balances performance, safety, and cost. Whether you’re a seasoned technician or a DIY enthusiast, this flux tin offers the reliability you need for flawless solder joints and efficient workflow.
Price: Original price was: $ 16.82.$ 5.60Current price is: $ 5.60.