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1/3Pcs High Quality Universal BGA Reballing Stencil – Square Hole Direct Heating Template for Mobile Phone, Laptop, CPU & IC Chip is the essential tool for technicians and hobbyists who demand precision, reliability, and speed when re‑balling BGA components. Engineered with premium materials and a universal design, this stencil delivers flawless solder ball placement on a wide range of devices, from smartphones to high‑performance laptops.
Why Choose This Universal BGA Reballing Stencil?
- Universal Fit: Compatible with most BGA packages used in mobile phones, laptops, CPUs, and IC chips.
- Square‑Hole Design: Optimized square apertures ensure uniform solder paste flow and accurate ball formation.
- Direct Heating Capability: Designed for direct heating reballing processes, reducing cycle time and improving yield.
- High‑Quality Construction: Made from durable, heat‑resistant stainless steel for long‑lasting performance.
- Easy Alignment: Precision‑cut edges and reference markers simplify placement on the PCB.
- Cost‑Effective Package: Comes in a 1/3 piece set, perfect for small‑batch repairs or prototype development.
Key Highlights
- Square hole pattern for consistent solder ball size.
- Direct heating compatible – works with infrared, hot‑air, and laser reballing stations.
- Universal dimensions accommodate a wide range of BGA footprints.
- Robust stainless‑steel material resists warping under high temperatures.
- Lightweight and easy to store – ideal for on‑the‑go technicians.
Compatibility
This stencil is engineered to fit the most common BGA configurations found in:
- Smartphones and tablets
- Laptop motherboards and graphics cards
- Desktop CPUs and server processors
- Embedded IC modules
- Development boards and prototype devices
How It Works
1. **Position the stencil** over the BGA component using the alignment markers.
2. **Apply solder paste** evenly across the square holes.
3. **Remove excess paste** with a gentle squeegee motion.
4. **Directly heat** the stencil and component to melt the paste into perfectly formed solder balls.
5. **Cool and inspect** – the result is a clean, reliable reballing job ready for re‑flow.
Technical Specifications
- Material: High‑grade stainless steel (304/316)
- Hole Shape: Square
- Hole Size: 0.30 mm × 0.30 mm (standard for 0.5 mm‑pitch BGA)
- Thickness: 0.15 mm
- Package: 1/3 piece (one stencil with two spare alignment guides)
- Operating Temperature: Up to 260 °C (500 °F)
Benefits for Your Repair Workflow
By choosing this universal BGA reballing stencil, you gain:
- Reduced rework time and higher first‑pass yield.
- Consistent ball size for improved electrical performance.
- Lower tool cost compared to custom‑made stencils.
- Greater flexibility across multiple device types.
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Price: $ 3.13